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 4-Pin SOP OptoMOS(R) Relay
CPC1130N
Blocking Voltage Load Current Max On-resistance
CPC1130N 350 120 30
Units V mA
Features * Small 4-Pin SOP Package * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * 1500Vrms Input/Output Isolation * No EMI/RFI Generation * Machine Insertable, Wave Solderable * Tape & Reel Version Available
Description The CPC1130N is a miniature 1-Form-B solid state relay which uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare's patented OptoMOS(R) architecture. The optically-coupled input is controlled by a highly efficient GaAIAs infrared LED. The CPC1130N offers board space savings of at least 20% versus competitive 4-Pin SOP solid state relay.
Approvals * UL Recognized Component: File #E76270 * Certified to EN60950
Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hookswitch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls
Ordering Information
Part # CPC1130N CPC1130NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel)
Pin Configuration
CPC1130N Pinout
Switching Characteristics of Switching Characteristics of Normally Closed (Form B) Devices Normally Closed (Form B) Devices
10ms CONTROL
+90% +10% TOFF
+
90% TON
2002/95/EC
RoHS
e3
www.clare.com 1
DS-CPC1130N-R02
CPC1130N
Absolute Maximum Ratings (@ 25C)
Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Capacitance Input to Output Isolation Voltage Input to Output Operational Temperature Storage Temperature
1
Ratings 350 5 50 1 150 400 1 1500 -40 to +85 -40 to +125
Units V V mA A mW mW pF Vrms C C
Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.
Derate Linearly 3.33 mw / C
Electrical Characteristics
Parameter Output Characteristics @ 25C Load Current AC Peak 1, Continuous Peak Load Current On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics @ 25C Input Control Current 3 Input Dropout Current Input Voltage Drop Reverse Input Current
1 2 3
Conditions 10ms IL=120mA VL=350V, IF=2mA IF=5mA, VL=10V IF=5mA, VL=10V 50V; f=1MHz IL=120mA IF=5mA VR=5V
Symbol IL ILPK RON ILEAK TON TOFF COUT IF IF VF IR
Min 2 0.3 0.9 -
Typ 25 25 0.9 1.2 -
Max 120 350 30 5 2 2 50 1.4 10
Units mA mA A ms ms pF mA mA V A
Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. Measurement taken within 1 second of on time. For applications requiring high temperature operation (greater than 60C) an LED drive current of 5mA is recomended.
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R02
CPC1130N
PERFORMANCE DATA*
CPC1130N Typical LED Forward Voltage Drop (Ambient Temperature = 25 C) IF = 5mADC
CPC1130N Typical On-Resistance Distribution (Ambient Temperature = 25 C) (Load Current = 120mA)
CPC1130N Typical Blocking Voltage Distribution (Ambient Temperature = 25 C)
Device Count (N)
Device Count (N)
Device Count (N)
LED Forward Voltage Drop (V)
On-Resistance ()
Blocking Voltage (V)
CPC1130N Typical IF for Switch Operation (Ambient Temperature = 25 C) (Load Current = 120mA)
CPC1130N Typical IF for Switch Dropout (Ambient Temperature = 25 C) (Load Current = 120mA)
CPC1130N Typical Turn-On Time (Ambient Temperature = 25 C) (Load Current = 120mA; IF = 5mA)
Device Count (N)
Device Count (N)
LED Current (mA)
LED Current (mA)
Device Count (N)
Turn-On (ms)
CPC1130N Typical Turn-Off Time (Ambient Temperature = 25 C) (Load Current = 120mA; IF = 5mA)
CPC1130N Typical Load Current vs. Temperature (IF=0, IL=AC Peak)
Load Current (mA)
CPC1130N Typical Leakage vs. Temperature (Measured across Pins 3 & 4) IL = max rated
Device Count (N)
Turn-Off (ms)
Leakage (A)
Temperature ( C)
Temperature ( C)
CPC1130N Typical Blocking Voltage vs. Temperature
Blocking Voltage (VRMS)
CPC1130N Typical Turn-On vs. Temperature (Load Current = 50mA)
CPC1130N Typical Turn-Off vs. Temperature (Load Current = 50mA)
Turn-Off (ms)
Turn-On (ms)
5mA 10mA
5mA 10mA
Temperature ( C)
Temperature ( C)
Temperature ( C)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
R02
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CPC1130N
PERFORMANCE DATA*
CPC1130N Typical LED Forward Voltage Drop vs. Temperature
LED Forward Voltage Drop (V)
CPC1130N Typical Turn-On vs. LED Forward Current (Load Current = 120mA)
CPC1130N Typical Turn-Off vs. LED Forward Current (Load Current = 120mA)
50mA 30mA 20mA 10mA 5mA
(ms)
Temperature ( C)
LED Forward Current (mA)
(ms)
LED Forward Current (mA)
CPC1130N Typical On-Resistance vs. Temperature (Load Current = max rated; IF = 5mA)
LED Current (mA)
CPC1130N Typical IF for Switch Operation vs. Temperature (Load Current = 50mA)
CPC1130N Typical Load Current vs. Load Voltage (Ambient Temperature = 25 C) IF = 5mA
Load Current (mA)
On-Resistance ()
Temperature ( C)
Temperature ( C)
Load Voltage (V)
CPC1130N Energy Rating Curve
Load Current (A)
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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Manufacturing Information Soldering Recommended soldering processes are limited to 260C component body temperature for 10 seconds.
2002/95/EC
Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents.
RoHS
e3
MECHANICAL DIMENSIONS
0.38 TYP. (0.015 TYP.)
4-Pin SOIC Narrow ("N" Suffix)
PC Board Pattern (Top View)
2.18 MAX. (0.086) 2.54 TYP. (0.100 TYP.)
Tape and Reel Packaging for 4 pin SOIC package
330.2 DiA (13.00" DiA) A0 = 6.50 (0.256) P = 8.00 (0.315) K1 = 2.30 (0.091)
A Top Cover Tape Thickness 0.102 MAX (0.004 MAX)
B0 = 4.70 (0.185)
W = 12.00 MAX (0.472 MAX)
A
K0 = 2.7 (0.106) SECTION A-A
NOTE: Tape dimensions not shown, comply with JEDEC Standard EIA-481-2
Embossed Carrier
Embossment
Dimensions: mm (inches) For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1130N-R02 (c)Copyright 2005, Clare, Inc. OptoMOS(R) is a registered trademark of Clare, Inc. All rights reserved. Printed in USA. 8/1/05
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